High-Reliability Ceramic Metallization for Hermetic Sealing & Electronic Integration
Metallization is the bridge between ceramics and metals. At Shunda Electronic Ceramics, we provide advanced surface metallization services for Alumina and Zirconia, enabling robust soldering, brazing, and wire bonding. Whether for high-voltage power electronics or ultra-high vacuum (UHV) components, our metallized coatings deliver exceptional adhesion and thermal stability.
Our Core Metallization Technologies
We select the optimal process based on your base material and final assembly requirements:
Mo-Mn Process (Molybdenum-Manganese): The industry standard for high-strength ceramic-to-metal bonding. Ideal for Alumina ceramics, providing a refractory base for high-temperature brazing.
Thick Film Metallization: Screen-printing of silver (Ag), silver-palladium (Ag-Pd), or tungsten (W) pastes for electronic circuits and heating elements.
Thin Film Sputtering: Vacuum-deposited layers for precision sensors and high-frequency RF components.
Active Alloy Processing: Specialized for Zirconia and other non-standard ceramics where traditional metallization is difficult.
Post-Metallization Plating Options
To ensure perfect solderability and corrosion resistance, we offer secondary plating services:
Nickel Plating (Ni): Electrolytic or Electroless; acts as a diffusion barrier for brazing.
Gold Plating (Au): Enhances wire bonding and provides superior oxidation resistance.
Copper Plating (Cu): Ideal for applications requiring high electrical conductivity.
Technical Performance & Validation
Applications of Metallized Ceramics
Power Electronics: High-voltage insulators for thyristors and IGBT modules.
Medical Equipment: Hermetic feedthroughs for diagnostic and surgical tools.
Aerospace: Ignition system insulators and sensor housings.
New Energy: Ceramic housings for EV battery relays and interrupters.
Why Engineers Trust Our Metallization?
Unmatched Adhesion: Our proprietary sintering profiles ensure the metallization layer "locks" into the ceramic grain structure.
Uniformity: Precision control over coating thickness, even on complex internal diameters and threads.
Seamless Integration: We provide ready-to-braze or fully brazed assemblies, reducing your supply chain complexity.
Ready to Discuss Your Metallization Needs?
Consult with our metallization specialists to find the right coating for your brazing or soldering requirements.
